IEC 62374-1 Ed. 1.0 b – Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Product Details
- Edition:
- 1.0
- Published:
- 09/29/2010
- Number of Pages:
- 32
- File Size:
- 1 file , 490 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
