IEC 62047-18 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 18: Bend testing methods of thin film materials
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
Product Details
- Edition:
- 1.0
- Published:
- 07/17/2013
- Number of Pages:
- 26
- File Size:
- 1 file , 550 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
