IEC 61189-5-301 Ed. 1.0 b

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: General test methods for materials and assemblies – Soldering paste using fine solder particles

Published by	Publication Date	Number of Pages
IEC	03/17/2021	64

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Category: IEC

IEC 61189-5-301 Ed. 1.0 b – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-301: General test methods for materials and assemblies – Soldering paste using fine solder particles

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).

This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.

This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 ?m or less).