IEC 60749-37 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Product Details
- Edition:
- 1.0
- Published:
- 01/30/2008
- Number of Pages:
- 39
- File Size:
- 1 file , 1 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
