Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
Product Details
- Edition:
- 3.0
- Published:
- 01/10/2008
- Number of Pages:
- 72
- File Size:
- 1 file , 1.1 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
