IEC 60191-6-18 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
Product Details
- Edition:
- 1.0
- Published:
- 01/07/2010
- Number of Pages:
- 40
- File Size:
- 1 file , 1.1 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
