IEC 60191-6-10 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Dimensions of P-VSON
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
Product Details
- Edition:
- 1.0
- Published:
- 11/19/2003
- Number of Pages:
- 24
- File Size:
- 1 file , 440 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus