This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.
Product Details
Published:
06/01/2016
Number of Pages:
21
File Size:
1 file , 120 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
