This specification covers the generic performance requirements for multilayered (three or more conductor layers) rigid-flex or flexible (with or without stiffeners) printed wiring boards (hereafter designated printed board) with plated holes that will use soldering for component/part mounting (see 6.1.1).
Product Details
- Published:
- 08/04/2017
- Number of Pages:
- 42
- File Size:
- 1 file , 680 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
