This specification covers the detail requirements for monolithic silicon, PROM microcircuits which employ thin film nichrome resistors (NiCr), titanium-tungsten (TiW), or zapped vertical emitter as the fusible link or programming element. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the part number. A special test requirement is included in this specification to screen against devices which may contain moisture in the package materials or internal atmosphere (see freeze-out test of 4.2d).
Product Details
- Published:
- 04/13/2012
- Number of Pages:
- 33
- File Size:
- 1 file , 530 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
