This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
Product Details
- Published:
- 05/10/2017
- Number of Pages:
- 1
- File Size:
- 1 file , 37 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
