1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.
Product Details
- Published:
- 01/01/1997
- Number of Pages:
- 3
- File Size:
- 1 file , 35 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
