BS 4584-103.1 – Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.
Cross References:
BS 4584:Part 1
Product Details
- Published:
- 02/28/1990
- ISBN(s):
- 0580181723
- Number of Pages:
- 12
- File Size:
- 1 file , 830 KB
- Product Code(s):
- 00209121, 00209121, 00209121
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
