This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (“FBGA” hereafter) and Fine-pitch Land Grid Array (“FLGA” hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Product Details
- Edition:
- 1.0
- Published:
- 06/27/2007
- Number of Pages:
- 15
- File Size:
- 1 file , 250 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
