IEC 60191-6-17 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for stacked packages – Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Product Details
- Edition:
- 1.0
- Published:
- 01/27/2011
- Number of Pages:
- 53
- File Size:
- 1 file , 640 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
