IEC 60191-6-3 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Product Details
- Edition:
- 1.0
- Published:
- 09/29/2000
- Number of Pages:
- 34
- File Size:
- 1 file , 320 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
