Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Product Details
- Edition:
- 1.0
- Published:
- 06/11/2003
- Number of Pages:
- 16
- File Size:
- 1 file , 500 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-4 Ed. 1.0 en:2003
Original price was: $92.00.$55.00Current price is: $55.00.
Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
standard by International Electrotechnical Commission, 06/11/2003
