IEC 60749-16 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 16: Particle impact noise detection (PIND)
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Product Details
Edition:
1.0
Published:
01/17/2003
Number of Pages:
13
File Size:
1 file , 200 KB
Note:
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