Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Product Details
- Edition:
- 1.0
- Published:
- 03/15/2004
- Number of Pages:
- 45
- File Size:
- 1 file , 850 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
