IEC 60749-35 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 35: Acoustic microscopy for plastic encapsulated electronic components
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Product Details
- Edition:
- 1.0
- Published:
- 07/18/2006
- Number of Pages:
- 43
- File Size:
- 1 file , 1 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
