Provides the component and land pattern dimensions for small outline integrated circuits with “J” leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Product Details
- Edition:
- 1.0
- Published:
- 10/30/2007
- Number of Pages:
- 15
- File Size:
- 1 file , 840 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
