IEC 61189-2-807 Ed. 1.0 b – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).
Product Details
- Edition:
- 1.0
- Published:
- 09/01/2021
- ISBN(s):
- 9782832210198
- Number of Pages:
- 22
- File Size:
- 1 file , 1 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
