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Attachment materials for electronic assembly – Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly standard by International Electrotechnical Commission, 03/22/2002
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Product Details
Edition:
1.0
Published:
03/22/2002
Number of Pages:
35
File Size:
1 file , 1.3 MB
Note:
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