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Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly standard by International Electrotechnical Commission, 04/26/2007
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Product Details
Edition:
2.0
Published:
04/26/2007
Number of Pages:
37
File Size:
1 file , 1.6 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
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