IEC 61190-1-2 Ed. 2.0 b:2007
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Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
standard by International Electrotechnical Commission, 04/26/2007
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Product Details
- Edition:
- 2.0
- Published:
- 04/26/2007
- Number of Pages:
- 37
- File Size:
- 1 file , 1.6 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
