IEC 61190-1-2 Ed. 3.0 b
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Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
| Published by | Publication Date | Number of Pages |
| IEC | 02/19/2014 | 46 |
IEC 61190-1-2 Ed. 3.0 b – Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of “Reflow condition and profile” in Annex B;
c) addition of a new Annex C.
Product Details
- Edition:
- 3.0
- Published:
- 02/19/2014
- Number of Pages:
- 46
- File Size:
- 1 file , 640 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
