IEC 63068-4 Ed. 1.0 en

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Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices – Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

Published by Publication Date Number of Pages
IEC 07/01/2022 30
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IEC 63068-4 Ed. 1.0 en – Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices – Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

This part of IEC 63068 provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies optical inspection and PL images to enable the detection and categorization of defects in SiC homoepitaxial wafers.

Product Details

Edition:
1.0
Published:
07/01/2022
ISBN(s):
9782832243077
Number of Pages:
30
File Size:
1 file , 7.9 MB
Note:
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