MIL MIL-DTL-47113E – Compound, Heat Sink, Silicone and/or Non-Silicone
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
Product Details
- Published:
- 05/15/2012
- Number of Pages:
- 11
- File Size:
- 1 file , 100 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
