This specification covers the detail requirements of monolithic silicon, PROM microcircuits which employ thin film nichrome resistors (NiCr), titanium tungsten (TiW), polycrystalline silicon (polysilicon), platinum silicide, zapped vertical diode, or zapped vertical emitter as the fusible link or programming element.
Product Details
- Published:
- 04/13/2012
- Number of Pages:
- 1
- File Size:
- 1 file , 49 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
