This specification covers the performance requirements for silicon, diffused, switching diodes, mounted with silicon-on-insulator technology as a very small sealed chip scale package (SCSP). They are available as single down-mounted device, or available in multiple arrays as designated by the NBN suffix. Two levels of product assurance are provided for the device type as specified in MIL-PRF-19500.
Product Details
- Published:
- 02/26/2016
- Number of Pages:
- 1
- File Size:
- 1 file , 35 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
