This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink.
Product Details
- Published:
- 12/09/2012
- Number of Pages:
- 55
- File Size:
- 1 file , 850 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
