To verify that markings or color coding will not become illegible or discolored on the parts (including printed wiring boards) when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed-wiring and terminal-board assemblies, etc. To verify that component protective coatings and encapsulant materials are not degraded to the point where electrical or mechanical integrity is disturbed when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed wiring and terminal board assemblies, etc.
Product Details
- Published:
- 04/18/2015
- Number of Pages:
- 9
- File Size:
- 1 file , 110 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
