IPC 7530B

This document describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.

Thermal profile is a unique temperature vs. time plot for each fully populated printed board assembly, using thermocouples attached to selected representative components of the printed board assembly as it travels at a given belt speed (i.e., transport speed) through various temperature zones of an oven or soldering system.